PCD die blanks

PCD self-supporting drawing die blanks are especially suitable for drawing dies with large consumption due to their low price.

Silicon based wire drawing die is suitable for drawing non-ferrous metals (copper, aluminum, iron, etc.), stainless steel and various alloy wires.

China hot-sales high-quality PCD wire drawing die silicon based blanks for stainless steel wire drawing

Professional manufacturing by Chinese wire drawing mold manufacturers Cobalt based PCD mold core contains metal bond, which has the advantages of high precision, high wear resistance, long life and excellent thermal conductivity.

PCD cobalt-based mold core with ring: the outside of the mold core is inlaid with a cemented carbide ring, and the cemented carbide ring gives the polycrystalline diamond stronger support to achieve high wear resistance and crack resistance.

Because the PCD wire drawing die core has the advantages of high hardness, good wear resistance, and strong impact resistance, most of the current diamond wire drawing dies use PCD wire drawing die cores.

Silicon based thermally stable diamond polycrystals pcd die blanks use silicon as a binder to form silicon carbide on the carbon atoms on the surface of silicon and diamond, connecting the diamond particles and particles.Since there is no metal adhesive in the silicon-based PCD core material, the material can still maintain good thermal stability at 1000 ° C, but its processability is relatively poor.

diamond dies blank PCD wire drawing die manufacturers

wholesales Self supported blanks round Diamond Wire Drawing Die Blanks Large size Silicon based drawing dies

Silicon based self-supporting wire drawing die blank products cover a wide range of wire drawing dimensions and applications. The unique material characteristics provide very good wear resistance and the ability to obtain high-quality surface finish.

OEM custom high-precision polycrystalline diamond dies for Drawing Gold Wire pcd blanks

PCD (polycrystalline diamond) cores are sintered from micron-sized diamond particles and binders under high temperature and high pressure conditions